TSMC Working on Sub-2nm Chips for the iPhone 20

TSMC chip fabrication

As the iPhone approaches its 20th anniversary in the next few years, speculation surrounds the potential features of the 2028 “iPhone 20.” One of the most anticipated advancements is the possibility of Apple incorporating TSMC’s groundbreaking 1.4nm chip technology, surpassing the current 2nm node size and offering significant performance and efficiency improvements.

TSMC recently unveiled its next-generation fabrication process, showcasing a leap forward from the industry-leading N2 process. The upcoming 1.4nm chips, rumored to be named A14, promise a 15% performance boost and 30% reduction in power consumption compared to the current 2nm processors. This innovation could make the “iPhone 20” a powerhouse with exceptional battery life.

While Apple’s adoption of the 1.4nm process has not been confirmed, the close relationship between Apple and TSMC suggests a high probability. Apple has a history of being at the forefront of chip technologies, often being the first to utilize TSMC’s new processes. The potential A22 chip for 2028 could benefit from this cutting-edge technology.

Apple’s journey with TSMC’s chip processes has seen ups and downs, with the company sometimes facing challenges with early adoption. The A17 Pro and M3 chips encountered yield problems with the N3B 3nm process, leading to a shift to the more stable N3E process for the A18 and M4 chips. Reports indicate that future Apple chips may continue with enhanced versions of the N3 process or explore sub-2nm processes.

Looking ahead, the 2027 “iPhone 19” may introduce the 1.6nm process, potentially setting the stage for the A21 chip. As Apple navigates the evolving landscape of chip technology, the anniversary of the iPhone’s 20th year may pass quietly, much like previous milestone moments in Apple’s product lineup.

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