The Future of Intel in 2025: Intel is gearing up for a significant year in 2025 as it works towards solidifying its comeback strategy under new leadership. With a focus on next-generation hardware, the company is positioning itself to reclaim its position as a leader in semiconductor manufacturing. As Intel’s production roadmap reaches a critical stage, the response from potential clients remains uncertain.
Kevin O’Buckley, senior vice president and general manager of Intel Foundry Services, announced the commencement of risk production for Intel’s upcoming 18A semiconductor node at the Intel Vision conference. This development signals a crucial phase in the production of next-generation laptop and server processors, reassuring investors and clients alike.
Risk production is a standard term in the industry, referring to the phase where manufacturers refine the production process for new chips. Intel is currently in the process of scaling up production from hundreds to thousands of 18A wafers.
Also see: How CPUs are Designed, Part 3: Building the Chip
While Intel has not disclosed any external clients committed to utilizing 18A for commercial chips, the company aims to achieve volume and mass production in time for the launch of its Panther Lake CPUs later this year. The finalization of 28A tape-out designs in the first half of 2025 sets the stage for Panther Lake to deliver significant advancements in AI performance compared to Intel’s Core Ultra 200V notebook processors.
Intel’s new CEO, Lip-Bu Tan, recently confirmed the scheduled releases of Nova Lake and Clearwater Forest chips in 2026. Nova Lake will integrate silicon from TSMC, Intel’s foundry rival, while Clearwater Forest will introduce 18A to the server market.
With the development of 18A, Intel is in a race to surpass TSMC in bringing sub-3nm technologies to market, including gate-all-around (GAA) transistors and backside power delivery. These innovations enhance performance by reducing power leakage and enabling higher transistor density. TSMC’s plans for GAA and backside power delivery are expected to debut with its N2 and A16 nodes next year.
Intel’s manufacturing has trailed behind competitors like TSMC and Samsung for some time. The 18A node represents a critical opportunity for Intel to regain confidence in its foundry business following a series of disappointing quarters that led to the departure of former CEO Pat Gelsinger.
Reports suggest that Nvidia and Broadcom are exploring the use of 18A for future products, although they are still in the early testing phase with Intel’s wafers. Apple is expected to be the first to adopt TSMC’s N2 node, likely debuting it in the A20 processor for the iPhone 18 Pro in late 2026. Other companies like AMD, Broadcom, Amazon AWS, and Intel are also anticipated to utilize N2.
Nvidia and Broadcom are reportedly interested in leveraging 18A for upcoming products, but they are likely in the initial testing stages with Intel’s wafers. Apple is positioned to be the primary adopter of TSMC’s N2, expected to debut with the A20 processor in the iPhone 18 Pro towards the end of 2026. AMD, Broadcom, Amazon AWS, and Intel are also projected to incorporate N2 in their future offerings.
